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Çelebi Kavdır, Elanur

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Kavdir,E.C.
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Dr. Öğr. Üyesi
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elanur.celebi@erzurum.edu.tr
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4.1. Makine Mühendisliği Bölümü
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Composites Part B-Engineering1
Composites Part B: Engineering1
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Now showing 1 - 2 of 2
  • Article
    The Experimental and Numerical Study on the Mechanical Behaviours of Adhesively Bonded Joints
    (Elsevier Sci Ltd, 2020) Kavdir, Elanur Celebi; Aydin, Murat Demir
    Experimental and numerical analyzes of single lap joints formed by combining AA2024-T3 aluminum alloys with two-component liquid structural adhesive DP410 were carried out in the present study. Tension and four-point bending experiments of single lap joints were performed in the experimental analysis section of this study in addition to 2-D Digital Image Correlation (DIC) analyses performed via the processing of the images obtained during these experiments. Whereas, three dimensional nonlinear finite element analyses of tensile and four point bending of single lap joints were performed for the numerical analysis section of the study by taking into consideration the load and boundary conditions applied during experimental analyses. Normal and shear strain distributions obtained via DIC and finite element method were compared by taking into consideration the middle line of the adhesive layer in the case of tensile and four-point bending loads of single lap joints. As a result of this comparison, it was found that there was a sufficient level of compatibility (not very close agreement) in strain distributions between finite element analyzes and DIC technique. As a result, it can be said that three-dimensional DIC analysis will yield more harmony and more accurate results when it is taken into account that three-dimensional finite element analysis and 2D DIC analysis were performed in the study.
  • Article
    The Investigation of Mechanical Properties of a Structural Adhesive Via Digital Image Correlation (DIC) Technic
    (Elsevier Science Ltd, 2019) Kavdir, Elanur Celebi; Aydin, Murat Demir
    The most important point to be taken into consideration in the use of bonding joints is the reliability of the joints created with the adhesive. Therefore, many analytical, experimental and numerical studies have been done to determine the mechanical properties of adhesives and to ensure the reliable use of adhesively bonding joints. This study presents the first stage of the two-stage study, which aims to determine the mechanical properties of the DP410 structural adhesive in the first stage and the mechanical behavior of the adhesively bonded single lap joints formed using the same adhesive in the second stage. In the study, mechanical properties of the DP410 structural adhesive were investigated experimentally via two dimensional Digital Image Correlation (DIC) technique. Bulk (tensile, Iosipescu and Arcan) and joint form (TAST) specimens were produced from structural bicomponent liquid adhesive (DP410) and subjected to uniaxial tensile and shear loads in the study. Mechanical properties of the DP410 bulk specimens were determined by two different measurement methods (DIC and video extensometer). It was observed upon comparing the results obtained that the DIC technique yielded reproducible results in the determination of the mechanical properties of adhesives and this method of optical measurement could be an alternative to other strain measurement methods. Shear mechanical properties of the DP410 adhesive were obtained via two different strain measurement methods, (DIC and contact extensometer) in the TAST specimens. When the results obtained from TAST specimens were examined, it was observed that the results obtained from DIC method were compatible with contact extensometer and it could be an alternative to contact extensometer. In addition, since local strain distributions can be obtained in the DIC method, it has been observed that this method allows to performe damage analysis of the specimens in bulk and joint form and to obtain the strain values at the desired positions. In this study, the accuracy of the results obtained from the 2D DIC analysis can be increased by using the software which allows to perform the 3D DIC analysis via high resolution cameras and by preparing the sample with the right methods.