Optimization of Variables Influencing the Thermal Conductivity and Fracture Strength of Reinforced PMMA by Using the Taguchi Method
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Date
2020
Journal Title
Journal ISSN
Volume Title
Publisher
Revista Chimie SRL
Open Access Color
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Abstract
How the particle size and volumetric ratio of silicon carbide (SiC) powder additions will strengthen polymethyl methacrylate (PMMA) is unclear. The purpose of this in vitro study was to optimize the reinforcement parameters of PMMA with SiC powder by using the Taguchi experimental design method. Particle size, volumetric rate, silane coupling rate, and mixing type were determined as parameters that would affect the reinforcement of PMMA with SiC powder. Using the Taguchi L9 orthogonal array, test specimens with different parameter combinations were fabricated and tested. The fracture load (in newtons) of each specimen group was recorded with the 3-point bend test. The thermal conductivity values of 60x50-mm and 3-mm-thick rectangular specimens were measured by using the Linseis THB 100 thermal conductivity unit. The thermal diffusivity values were then calculated. Thermal analysis indicated improvement in the thermal conductivity of PMMA after reinforcement with SiC. The maximum thermal diffusivity was obtained with 15% SiC powder by volume. Thermal conductivity and flexural strength increased with an increase in particle size. The maximum flexural strength value was obtained with 5% SiC powder by volume. Increasing the particle size of the filler SiC powder resulted in increased thermal conductivity and flexural strength. Increasing the SiC filler powder by volume increased the thermal conductivity of PMMA but reduced its flexural strength. This study helped determine the optimum conditions for the use of SiC powder. Knowledge of the importance of these variables will help in more effective modification of denture base resin with SiC powder to improve heat transfer without adversely affecting strength.
Description
Mandev, Emre/0000-0002-6791-4136;
ORCID
Keywords
Denture Base Material, Taguchi Method, SiC Powder, Thermal Conductivity
Fields of Science
Citation
WoS Q
Q4
Scopus Q
N/A
Source
Materiale Plastice
Volume
57
Issue
3
Start Page
137
End Page
146
